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Manufacturing process

How a job moves from quote to shipment

Every unit moves through defined production, firmware, test, and quality gates. Each step is checked before the unit moves on.

SMT production line

Three DDM Novastar machines on our floor in Strumica. Every board passes through this sequence: paste, place, reflow.

DDM Novastar SPR-45 stencil printer

Step 1 · Paste

DDM Novastar SPR-45

Stencil printer

  • 16 × 18 in print area
  • 310 mm max board width
  • Dual squeegee, semi-automatic
DDM Novastar LS60 pick-and-place

Step 2 · Place

DDM Novastar LS60

Pick-and-place

  • 0201 to 35 mm components, BGA to 15 mil pitch
  • ±0.025 mm placement accuracy
  • 96 feeders (144 with bank), up to 4800 cph
DDM Novastar GF-120HT reflow oven

Step 3 · Reflow

DDM Novastar GF-120HT

Reflow oven

  • 6 zones (3 top, 3 bottom), 400°C max
  • 1042 mm heated tunnel, 305 mm conveyor
  • Lead-free SAC305, 100 stored profiles

The full production sequence

  1. RFQ INPUT

  2. RFQ

    Quote review against your BOM, gerbers, and CPL. Capacity and DFM check before we commit.

  3. DFM and BOM

    Design-for-manufacturing analysis, alternate part proposals, dual-source identification, AVL alignment.

  4. Component sourcing

    Procurement against the AVL with lead-time risk flagging.

  5. Solder paste printing

    DDM Novastar SPR-45 stencil printer, dual squeegee, 16 by 18 inch print area.

  6. Pick-and-place

    DDM Novastar LS60, vision-assisted placement across 96 to 144 feeders.

  7. Reflow soldering

    DDM Novastar GF-120HT, six-zone horizontal convection, lead-free SAC305 capable.

  8. AOI (in-house)

    Automated optical inspection of placement and joints against IPC-A-610 acceptance criteria, on our line, on every board.

  9. Firmware flashing

    In-line or offline programming with multi-image support and signed bootloader chains.

  10. Functional test (sourced)

    Coordinated through partner test houses against your test plan when required. Fixtures, golden unit, and per-unit results managed by us; testing physically runs at the partner site.

  11. Secure provisioning

    X.509 enrollment, secure-element key injection, eFuse or OTP burn where required.

  12. Serialization and labeling

    MAC, UID, or serial assigned, GS1 DataMatrix or QR labels applied.

  13. Box-build

    Sub-assembly into housing, cabling, gasketing, antenna placement, mechanical integration.

  14. Final QC

    Sample IP rating verification, label verification, batch sign-off.

  15. Shipment

    Programmed, inspected, serialized, packed units leave the line ready for the field.

  16. SHIPMENT OUTPUT

Quality and verification at each gate

  • IPC-A-610 acceptance criteria applied per board

    Class 2 or Class 3 inspection profile selected per project.

  • AOI on every assembled board (in-house)

    Camera-based inspection of solder joints and component placement, on our line.

  • FCT sourced when required

    Functional test coordinated through partner test houses against your test plan. Per-unit pass and fail results returned and logged against serial number.

  • Per-unit traceability database

    Serial, firmware hash, batch, operator, machine program logged for every unit.

  • Lead-free solder profile

    SAC305 reflow profile, RoHS compliant by default.

  • Defect routing and root cause

    Failures quarantined, reworked under IPC-7711 procedures or scrapped.

See your product through this flow

Send files. We map them to each stage and reply with a quote within one business day.

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