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Capability

Solder Paste Printing

Solder paste printing is the first stage of the in-house SMT PCB production line. Stencil aperture geometry plus paste rheology plus squeegee pressure together decide whether the joints downstream will be reliable. The SPR-45 gives us deterministic deposit control across mixed component sizes.

Equipment on the line

DDM Novastar SPR-45 on the Energetika-VDS SMT line

Gold Print

DDM Novastar SPR-45

Solder paste stencil printer

Max board width
310 mm
Stencil frame
up to 23 by 23 inch
Print area
16 by 18 inch
Drive
Semi-automatic, dual squeegee
Power
110 V AC, 2 A

Our SMT line runs the full product lifecycle on the same equipment: NPI, pilot, and recurring production. Single-shift placement capacity is approximately 4.8 million components per year (roughly 80 000 simple boards, 40 000 mid-complexity boards, or 12 000 meter-class boards per year), and scales linearly to a three-shift ceiling near 14.4 million placements per year. We are a high-mix manufacturer: we keep changeover discipline tight, so a 500-unit batch and a 50 000-unit annual programme run on the same line.

Process detail

  1. STAGE INPUT

  2. Stencil mount

    Frame loaded into the printer, alignment verified to fiducials.

  3. Paste load

    SAC305 lead-free paste loaded onto the stencil, conditioned for viscosity.

  4. Print stroke

    Dual squeegee deposits paste through stencil apertures.

  5. Inspection

    Visual or SPI check on first article and at intervals.

  6. STAGE OUTPUT

Files we accept

  • Gerber paste layer
  • ODB++ paste layer
  • Stencil DXF if pre-fabbed

Tolerances and specs

Print area
16 by 18 inch (406 by 457 mm)
Stencil frame
up to 23 by 23 inch
Drive
Semi-automatic dual squeegee
Power
110 V AC, 2 A

Frequently asked questions

Which design files do you accept?

Gerber RS-274X, ODB++, and IPC-2581 for PCB data. BOM in xlsx or csv with manufacturer part numbers. CPL or pick-and-place file in csv or txt. Step files for enclosures. Firmware binaries as hex, bin, or signed image bundles.

Discuss this capability

Share your BOM, gerbers, and CPL. Engineering reviews fit, throughput, and DFM, and replies within one business day.

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