- Max board width
- 310 mm
- Stencil frame
- up to 23 by 23 inch
- Print area
- 16 by 18 inch
- Drive
- Semi-automatic, dual squeegee
- Power
- 110 V AC, 2 A
Capability
SMT PCB Production Line
Our in-house SMT PCB production line runs as one continuous process, from solder paste deposit through component placement to soldering and reflow. Each step feeds the next, with vision verification at placement and AOI after reflow.
Equipment on the line
- Board size
- 330 to 343 mm by 304 to 813 mm
- Throughput
- up to 4800 cph (typical 2500 to 3600)
- Component range
- 0201 to 35 mm bodies, BGA, 15 mil pitch QFP
- Feeders
- 96 single positions (144 with bank), 8 to 68 mm tape, tray, tube, loose
- Nozzles
- 4 standard
- Accuracy
- +/- 0.025 mm
- Max component height
- 16 mm
- Conveyor width
- 305 mm
- Heated tunnel
- 1042 mm
- Heating zones
- 3 top + 3 bottom (horizontal convection)
- Max temperature
- 400 C
- Solder profiles
- lead-free SAC305 capable
- Stored profiles
- 100
- Power
- 220 V AC, 50 A, single-phase
Our SMT line runs the full product lifecycle on the same equipment: NPI, pilot, and recurring production. Single-shift placement capacity is approximately 4.8 million components per year (roughly 80 000 simple boards, 40 000 mid-complexity boards, or 12 000 meter-class boards per year), and scales linearly to a three-shift ceiling near 14.4 million placements per year. We are a high-mix manufacturer: we keep changeover discipline tight, so a 500-unit batch and a 50 000-unit annual programme run on the same line.
Process detail
- STAGE INPUT
-
Solder paste printing
Stencil mounted, paste loaded, dual-squeegee deposit across the panel.
-
Pick-and-place assembly
Vision-assisted placement from up to 144 feeders.
-
Soldering and reflow
Six-zone horizontal convection reflow, profile selected from 100 stored options.
-
Inspection
Automated optical inspection of placement and joints against IPC-A-610 acceptance criteria.
-
Optional firmware loading
In-line firmware loading when included in the scope. Functional test is sourced through partners when the test plan requires it.
- STAGE OUTPUT
Files we accept
- Gerber RS-274X
- ODB++
- IPC-2581
- BOM (xlsx, csv)
- CPL or pick-and-place (csv, txt)
- Assembly drawing (pdf, dxf)
Tolerances and specs
- Placement accuracy
- +/- 0.025 mm
- Min component
- 0201
- Max component height
- 16 mm
- BGA pitch
- down to 15 mil (0.38 mm)
- Board size
- 330 to 343 mm by 304 to 813 mm
Throughput
Up to 4800 cph theoretical, typical mixed-board 2500 to 3600 cph
Frequently asked questions
Which design files do you accept?
Gerber RS-274X, ODB++, and IPC-2581 for PCB data. BOM in xlsx or csv with manufacturer part numbers. CPL or pick-and-place file in csv or txt. Step files for enclosures. Firmware binaries as hex, bin, or signed image bundles.
How is solder joint quality verified?
Automated optical inspection runs on every assembled board against IPC-A-610 acceptance criteria. We support Class 2 and Class 3 inspection profiles. X-ray inspection is available through partner labs for BGA and high-density boards when required.
What is your minimum order quantity?
No fixed minimum. We run NPI pilots from a single unit through recurring production into the tens of thousands per year. Single-shift line capacity is approximately 4.8 million component placements per year; programmes above that level we plan jointly across multiple shifts during DFM and BOM review.
Discuss this capability
Share your BOM, gerbers, and CPL. Engineering reviews fit, throughput, and DFM, and replies within one business day.