Process detail

  1. STAGE INPUT
  2. AOI (in-house)

    Camera inspection of every joint and component against IPC-A-610 criteria on our own line.

  3. X-ray (partner)

    BGA and high-density boards routed to partner X-ray when required.

  4. Functional test (sourced)

    Coordinated through partner test houses against your test plan when required. We manage the handoff, fixture transfer, and results capture.

  5. Pass and fail logging

    AOI results and partner-returned FCT results captured per unit with serial and firmware hash.

  6. STAGE OUTPUT

Files we accept

  • Test plan document
  • FCT vector list for partner handoff
  • Reference unit (golden sample)
  • Test fixture CAD if existing

Tolerances and specs

AOI coverage (in-house)
Every board
Acceptance
IPC-A-610 Class 2 or Class 3
FCT sourcing
Coordinated through partner test houses on request

Frequently asked questions

How is solder joint quality verified?

Automated optical inspection runs on every assembled board against IPC-A-610 acceptance criteria. We support Class 2 and Class 3 inspection profiles. X-ray inspection is available through partner labs for BGA and high-density boards when required.

Do we need a written test plan?

Yes when functional test is in scope. A production test plan defines pass and fail criteria, FCT vectors, calibration steps, and serialization rules. We help draft one if your team has not written one yet, based on your firmware behavior and target field performance. The test plan is handed to the partner test house we coordinate with for FCT.

How do you handle defects and rework?

Defects flagged during in-house AOI or returned from partner functional test are root-caused and either reworked under IPC-7711/7721 procedures or scrapped depending on root cause. Failure data feeds back into DFM review for the next batch.

Discuss this capability

Share your BOM, gerbers, and CPL. Engineering reviews fit, throughput, and DFM, and replies within one business day.